{"id":23618,"date":"2025-05-21T17:31:32","date_gmt":"2025-05-21T09:31:32","guid":{"rendered":"https:\/\/www.meetyoucarbide.com\/?p=23618"},"modified":"2025-05-22T10:02:10","modified_gmt":"2025-05-22T02:02:10","slug":"picosecond-lasersfor-carbide-products","status":"publish","type":"post","link":"https:\/\/www.meetyoucarbide.com\/vi\/picosecond-lasersfor-carbide-products\/","title":{"rendered":"Picosecond Lasers: Your First Choice for Machining Carbide Products on\u00a0Microstructure"},"content":{"rendered":"
This study examines picosecond laser processing of carbide product across different energy densities, analyzing effects on surface roughness, composition and material removal to identify distinct interaction mechanisms.<\/p>\n
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Laser processing may sound like futuristic sci-fi tech, but it works by focusing a laser beam to deliver energy to the workpiece, locally heating the material to melt, vaporize, or remove it\u2014all without physical contact. Unlike traditional grinding, this method eliminates tool wear and deformation while boosting efficiency and precision. Most importantly, laser processing isn\u2019t limited by material hardness or toughness, making it ideal for even the most challenging alloys.<\/p>\n
Laser processing isn’t limited to just one approach. Based on pulse duration, it can be categorized into:<\/p>\n
1.Nanosecond lasers \u2013 Like a broadsword:Longer pulses (wider heat-affected zone)\u00a0and suitable for less precision-critical applications<\/p>\n
2.Picosecond & femtosecond lasers \u2013 Like precision engraving tools:Ultra-short pulses (minimal heat-affected zone),enable high-precision, low-damage processing, and femtosecond lasers (pulses in quadrillionths of a second) remove\/modify material instantaneously with zero peripheral impact.<\/p>\n
While femtosecond lasers offer extreme precision, their equipment costs too much. Picosecond lasers strike the ideal balance, including simplified design,stable performance,lower operating costs,and sufficient efficiency for most applications.Those points make picosecond lasers the preferred choice for processing of carbide product in industrial settings.<\/p>\n
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The experiment used YG8 carbide product with sample dimensions of 50mm\u00d750mm\u00d72mm. Laser processing was conducted on a self-developed five-axis picosecond laser milling machine. The laser parameters were:<\/p>\n
Wavelength: 1064nm<\/p>\n
Pulse width: 10ps<\/p>\n
Repetition rate: 2000kHz<\/p>\n
Spot diameter: 30\u03bcm<\/p>\n
Four energy density (ED) levels were tested:<\/p>\n
0.45J\/mm\u00b2, 1.05J\/mm\u00b2, 1.65J\/mm\u00b2, and 2.25J\/mm\u00b2<\/p>\n
A 10% scan overlap ratio was selected based on appropriate beam traversal speed ranges and experimental requirements, with single-pass processing (one laser scan per surface).<\/p>\n
The energy density calculation formula is:<\/p>\n
<\/p>\n
<\/p>\n
where:<\/p>\n
P = Laser power (W)<\/p>\n
D = Focused laser beam diameter (mm)<\/p>\n
V\u2093 = Laser transverse scanning speed (mm\/s)<\/p>\n
Energy density variation was achieved by adjusting laser power. As shown in Figure 1, the laser followed path a for transverse motion and path b for cross-feed motion. Post-processing, samples were ultrasonically cleaned in anhydrous ethanol for 15 minutes and dried.<\/p>\n
The three-dimensional contour morphology of the sample surface after laser processing was observed by using the product measuring instrument (Bruker Alicona Infinite Focus SL), and the surface roughness and processing depth were detected. The obtained results were all the average values of the five measurement results.<\/p>\n
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(a) Experimental apparatus<\/p>\n
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(b) Processing procedure<\/p>\n
Figure 1 Ultrafast laser processing of carbide product<\/p>\n
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When processing the surface of materials with ultrafast lasers, the energy flow density of the laser needs to reach above the ablation threshold of the material to cause ablation to the material. The surface morphologies processed by laser under different energy densities are shown in Figure 2.<\/p>\n
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(a) The energy flow density is 0.45J\/mm \u00b2<\/p>\n
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(b) The energy flow density is 1.05J\/mm \u00b2<\/p>\n
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(c) The energy flow density is 1.65J\/mm \u00b2<\/p>\n
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(d)The energy flow density is 2.25J\/mm \u00b2<\/p>\n
Figure 2 Surface morphology of laser processing with different energy flow densities<\/p>\n
At low energy density (0.45J\/mm\u00b2), the laser-processed surface shows varied ablation morphologies due to the Gaussian beam profile. Only the central high-energy zone exceeds the ablation threshold, forming sparse LIPSS structures (Fig.2a3), while peripheral areas retain base material features (Fig.2a1). Partial Co binder removal between WC particles creates micron-scale protrusions via thermal diffusion.<\/p>\n
Above 1.05J\/mm\u00b2, stable LIPSS structures form, with periodicity determined by laser wavelength and material dielectric properties. These result from laser-induced phase transitions and resolidification. Energy variations along cross-feed directions create morphological differences.<\/p>\n
With increasing energy density:<\/p>\n
1.05J\/mm\u00b2 produces periodic LIPSS with nano-protrusions (Fig.2b1) from phase explosion<\/p>\n
1.65J\/mm\u00b2 shows reduced protrusions and added nanoparticles (Fig.2c1)<\/p>\n
2.25J\/mm\u00b2 exhibits complete protrusion replacement by dense nanoparticles (Fig.2d1)<\/p>\n
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Surface defects in laser processing are closely related to material defects and process parameters. Understanding their formation mechanisms enables better process optimization for smooth, defect-free surfaces. When laser-material interaction is thermally dominant at low energy densities (0.45J\/mm\u00b2), a shallow surface melting mechanism occurs, achieving laser polishing.<\/p>\n
As shown in Figs. 3a-b, laser-processed WC-Co surfaces (0.45J\/mm\u00b2) become smoother compared to original ground surfaces with visible scratches. This improvement results from melted convex peaks flowing into adjacent valleys under capillary forces. Fig. 3f demonstrates that laser processing at 0.45J\/mm\u00b2 reduces surface roughness by ~15% versus the original ground surface (Ra=0.187\u03bcm).<\/p>\n
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